TSMC Reportedly Skips High-NA EUV for A14 (1.4nm) Node, Focuses on Cost-Efficiency
Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly opting not to adopt High Numerical Aperture Extreme Ultraviolet (High-NA EUV) lithography for its upcoming A14 (1.4nm) process node, instead focusing on cost-efficiency over the performance gains offered by the advanced technology. This strategic decision reflects TSMC’s cautious approach to integrating new technologies into its manufacturing processes.​ Understanding …
