Apple Drives TSMC’s SoIC Advanced Packaging Growth Amid Rising Demand
Apple is reportedly the primary force behind the rapid expansion of Taiwan Semiconductor Manufacturing Company’s (TSMC) System-on-Integrated-Chip (SoIC) advanced packaging technology. This development highlights Apple’s strategic focus on enhancing chip performance and efficiency for its future devices. SoIC: A Leap in Chip Integration SoIC is TSMC’s cutting-edge 3D chip stacking technology that enables the vertical …
